数据列表21-0382 Pkg Drawing;

DS2430A;

标准包装  4,000包装  标准卷带 零件状态有源类别集成电路（IC）产品族存储器系列-

规格

存储器类型非易失存储器格式EEPROM技术EEPROM存储容量256b （32 x 8）存储器接口1-Wire写周期时间 - 字，页-访问时间15μs电压 - 电源-工作温度-40°C ~ 85°C（TA）安装类型表面贴装型封装/外壳6-LSOJ（0.148"，3.76mm 宽）供应商器件封装6-TSOC

文档

应用说明1-Wire Master Device Configuration

1-Wire Software Resource Guide Device Description

IEEE 1451.4 Class 1 MMI Smart Transducer Digital Driver Circuit

Minimal Remote 1-Wire Master Protocol

Reading and Writing 1-Wire Devices Through Serial Interfaces

Transition Guide: Replacing the DS2430A with the DS2431

Understanding Flip-Chip and Chip-Scale Package Technologies and Their Applications

Understanding the DS1WM Synthesizable 1-Wire Bus Master

RoHS指令信息Halogen Certificate

Maxim RoHS3 Statement

Red Phosphorous Certificate

图像和媒体

产品相片6-TSOC

数据列表21-0382 Pkg Drawing;

DS2430A;

标准包装  4,000包装  标准卷带 零件状态有源类别集成电路（IC）产品族存储器系列-

规格

存储器类型非易失存储器格式EEPROM技术EEPROM存储容量256b （32 x 8）存储器接口1-Wire写周期时间 - 字，页-访问时间15μs电压 - 电源-工作温度-40°C ~ 85°C（TA）安装类型表面贴装型封装/外壳6-LSOJ（0.148"，3.76mm 宽）供应商器件封装6-TSOC

文档

应用说明1-Wire Master Device Configuration

1-Wire Software Resource Guide Device Description

IEEE 1451.4 Class 1 MMI Smart Transducer Digital Driver Circuit

Minimal Remote 1-Wire Master Protocol

Reading and Writing 1-Wire Devices Through Serial Interfaces

Transition Guide: Replacing the DS2430A with the DS2431

Understanding Flip-Chip and Chip-Scale Package Technologies and Their Applications

Understanding the DS1WM Synthesizable 1-Wire Bus Master

RoHS指令信息Halogen Certificate

Maxim RoHS3 Statement

Red Phosphorous Certificate

图像和媒体

产品相片6-TSOC